EN
Introduction
The LED Screens industry is still relatively a young member of the displays family, however with every turn in technology it becomes harder to imagine what more can be possible concerning image quality and brightness balanced with low power consumption. Flip Chip+Chip on Board Technology (COB) is one such innovation that has got a lot of exposure and abstraction. With this method, so many other enhancement options exist that it really becomes the premiere choice for packaging goods to appeal not only in terms of necessity by manufacturers but also demand from customers or buyer. Here, let us introduce flip chip COB technology with its advantages being developed to be the new favorite for high performance LED displaying in this article.
What is Flip Chip COB Technology?
The flip chip COB method is different from the conventional Surface-Mounted Device (SMD) packaging only in that this technology does not employ bonding wire for die attachment. LED chips are placed on a board in the SMD process, upside down with their active surface facing up (although wire bonding is required to connect them electrically). This restricts the pixel density of LED chip and results in restricted display resolution.
In contrast, flip chip COB technology has the LED chips directly on to substrate with their active side down. It is face-down packaging and gives a more efficient heat dissipation path. Heat is conducted directly to the substrate from LED chips, reducing operational temperatures and extending display life.
Flip-chip COB packing requires to directly attach the LED chips onto its substrate and then a BBAR coated with thermally conductive epoxy resin that covers all integrated silicon wafer. Electrical connections are established by wire welding after heat treatment. It simplifies the assembly process, reduces gold or copper wire connection number and improves display stability.
Benefits of FLIP CHIP COB Technology
Using flip chip COB technology in LED displays has many advantages, including:Higher Reliability—Without wiring in package layer, the packaging is thinner and lighter that lowers thermal resistance provides better light quality as well as longer display lifetime.
Better Display Effect: Adopt flip-chip COB to decrease packaging layer thickness, which can effectively solve the problems of color lines and differences in brightness between modules. The technology gives support for HDR imaging, thus makes the static and dynamic image much more detailed.
Ultra-Fine Pixel Pitch: Real chip-level of real packaging, being able to hit the pixel pitch limit also makes flip-chip COB an obviously better candidate for sub-pixel pitches.
Energy saving: under the same brightness, flip chip technology can save a lot of electricity. The smaller the footprint of a flip-chip placed on PCB, which offers larger open area for this board with total light-emitting area and higher efficiency.
Is The Market Trend On Flip-Chip COB LED Display?
Absolutely. They are synchronized with key display market requirements today in resolution, ruggedness and brightness – precisely the benefits of flip-chip COB LED technology. With increasing demands from both consumers and industries for higher-performance displays, the market demands increasingly reliable flip-chip COB LEDs as a future trend in real-world applications.
Conclusion
The rise of flip chip COB technology, is not just a fad and will absolutely lead the LED display to another level. This technology has been providing better reliability, better display quality, ultra-fine pixel pitch and energy efficient also it is proving to be a new benchmark for high performance LED Display. Given ongoing market requirements on advanced display technologies, flip chip COB will deliver exactly what is expected and more to become a clear winner for manufacturers as well as end-users. From large outdoor billboards to the clearest indoor HD displays and everything in between, flip chip COB technology is rearing as a lasting solution for LED display.
